Power of Intelligent New Technology
Point Engineering is able to manufacture small sized Micro bumps with Micro bump with various designs
based on differentiated AAO and MEMS technology.
Item | Spec | Tolerance |
---|---|---|
Bump diameter | 10 ~ 200 um | ± 2um |
Bump height | 10 ~ 100 um | ± 2um |
Solder layer | 2 ~ 5 um | ± 1um |
Bump Material | Cu, Au and Ti etc | - |
Solder Material | Sn, Ni, AuSn and AgSn | - |
Point Engineering's AAO and MEMS technology provide wide range of options to customers.
Reliability Tests | Results |
---|---|
Moisture Sensitivity Level (MSL 3) | +200 Hours |
(30°C / 60RH%) | |
Temperature Cycle "B" | +1000 Cycles |
(-55°C / +125°C) | |
High Temperature Storage | +1200 Hours |
150°C | |
Temperature Humidity Bias (THB) | +1200 Hours |
(85°C / 85RH%) | |
Unbiased HAST | +110 Hours |
(130°C / 85TH%) |