Product

Power of Intelligent New Technology

MEMS business

Micro Pillar Bump
Conventional C4 Bump

  • Diameter: 50 ~ 200um
  • Pitch: 30 ~ 200um
  • Solder Cap shape: Oval
PEC Micro Pillar Bump
  • Diameter: 10 ~ 100um
  • Pitch: 15 ~ 150um
  • Solder Cap shape : Per customer's request
  • Material : Per customer's request
  • Minimize size up to ∅10um
  • Narrow the pitch up to ∅15um
  • Freedom of shape and design
  • Fully vertical Cu Pillar
Design Guideline
Solder layerSolder bump
Materials ① SnAg / ② Ni
Thickness 3 ~ 6um (± 1)
PillarPillar Material
Materials ① Cu / ② Au
Size 10 ~ 100um (± 1)
Thickness 10 ~ 100um (± 3)
Design

Able to customize per customer's request

Array pitch

20 ~ 150um