Technology

Power of Intelligent New Technology

MEMS technology

Conventional Mold
  • Complicate process to increase thickness
  • Limited to make accurate design

PEC AAO Mold
  • Vertically wet-etchable material
  • Simplify process via Single mold layer
  • Enable precise patterning with 1:30 aspect ratio
MEMS foundry service
  • Photolithography : 4-inch, 6-inch, 8-inch, front & back alignment available
  • Dry film liminator : Vacuum/Roll type
  • Metal or metal-oxide compound Deposition(Sputter) : Sputter Ti, Ta, Au, Ag, W, TiOx, TaOx
  • Dry Etching(ME-RIE) : Al, Pt, Ta, Metal-Oxide(TaOx, TiOx)
  • Electro/Electroless Plating
  • Dicing(Blade type)
  • Analysis : SEM/EDS, CD-SEM(8", in-line system)

Optical analysis(Micro scope, Infrared analysis)

Electrical measurements(Source meter, Power supply, Pulse generator, etc)

Application
  • MEMS Pin
  • Micro bump
  • Etc.