Materials
① SnAg / ② Ni
Our Address
89, Asanvalley-ro, Dunpo-myeon, Asan-si, Chungcheongnam-do, Republic of Korea
Urgent issue? call us at
+82–4–546-5131
R&D
- Home
- R&D
R&D Project
-
Conventional C4 Bump
- Diameter: 50 ~ 200um
- Pitch: 30 ~ 200um
- Solder Cap shape: Oval
-
PEC Micro Pillar Bump
- Diameter: 10 ~ 100um
- Pitch: 15 ~ 150um
- Solder Cap shape: Per customer's request
- Material: Per customer's request
- Minimize size up to ∅10um
- Narrow the pitch up to ∅15um
- Freedom of shape and design
- Fully vertical Cu Pillar
Leading the new era with
Cutting-edge semiconductor packaging solution
Micro Pillar Bump
Solder layer
Thickness
3 ~ 6um (± 1)
Pillar
Materials
① SnAg / ② Ni
Size
10 ~ 100um (± 1)
Thickness
10 ~ 100um (± 3)
Design
Array pitch
(20 ~ 150um)
