Technologies

MEMS foundry service

• Photolithography : 4-inch, 6-inch, 8-inch, front & back alignment available
• Dry film laminator : Vacuum/Roll type
• Metal or metal-oxide compound Deposition(Sputter) : Sputter Ti, Ta, Au, Ag, W, TiOx, TaOx
• Dry Etching(ME-RIE) : Al, Pt, Ta, Metal-Oxide(TaOx, TiOx)
• Electro/Electroless Plating
• Dicing(Blade type)
• Plating materials ex) Pd-Co, Ni-Co, Au, Cu, Rh
• Fully automated plating equipment
• Analysis : SEM/EDS, CD-SEM(8", in-line system)
  • Optical analysis(Micro scope, Infrared analysis)
  • Electrical measurements(Source meter, Power supply, Pulse generator, etc)