
MEMS Technology
MEMS foundry service
- Photolithography : 4-inch, 6-inch, 8-inch, front & back alignment available
- Dry film laminator : Vacuum/Roll type
- Metal or metal-oxide compound Deposition(Sputter) : Sputter Ti, Ta, Au, Ag, W, TiOx, TaOx
- Dry Etching(ME-RIE) : Al, Pt, Ta, Metal-Oxide(TaOx, TiOx)
- Electro/Electroless Plating
- Dicing(Blade type)
- Plating materials ex) Pd-Co, Ni-Co, Au, Cu, Rh
- Fully automated plating equipment
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Analysis : SEM/EDS, CD-SEM(8", in-line system)
- Optical analysis(Micro scope, Infrared analysis)
- Electrical measurements(Source meter, Power supply, Pulse generator, etc)
In-house
production system
Automated systems for excellent
quality control Time & cost efficient.
